Raspberry PI 4 generation 4B cooling copper wafer with 3M Adhesive Back Size: 14*10*1MM

The Raspberry Pi 4 Generation 4B Cooling Copper Wafer is a compact solution for temperature management. With a size of 14x10x1mm and 3M adhesive backing, this copper wafer efficiently dissipates heat, enhancing the Raspberry Pi 4’s performance. Its small form factor and adhesive design make it easy to install, ensuring optimal cooling for the device.

Features:

1. Cooling Copper Wafer for Raspberry Pi 4 Generation 4B
2. Efficient Heat Dissipation
3. 3M Adhesive Backing for Easy Installation
4. Enhances Raspberry Pi 4 Performance
5. Optimal Temperature Management

Package Includes:

1 x Raspberry PI 4 generation 4B cooling copper wafer with 3M Adhesive Back Size：14*10*1MM